Breakthrough Innovation in IC package decapsulation
JIACO INSTRUMENTS
The JIACO Instruments MIP decapsulation system allows one to access the area of interest during failure analysis protocol easily and facilitates the determination of the cause of the failure. Its benefits include rapid sample preparation without the introduction of artifacts, which may contribute uncertainty to the fault detection process. This MIP system, in turn, allows the engineer to reach a conclusion as to the actual root cause of the problem, and to define a permanent fix to remove the issue for the future. This MIP plasma system is also invaluable during qualification procedures for new processes and materials.
JIACO Instruments MIP decapsulation system is a breakthrough innovation: Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilizing only Oxygen and patent-pending Hydrogen-based recipes. The system has been proven for Cu, PCC, Ag, Au bond wires, and for advanced package types like 3D, SiP WLCSP, BOAC, all without process-induced damage for reliability test and failure analysis.