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- Measurable elements: S to U
- Limit of detection (LOD) reaches 1ppm
- Excellent repeatability 0.1%
- Long-time working stability 0.1%
.Download brochure EDX1800B
Plating Thickness Analyzer
- Analyzable minium thicknes down to 0.01um
- Collimator is within 0.1mm and facula is within 0.2mm
- Electronic height sensor
- High stability copper X-ray tube with micro facula
- High-accuracy movable sample platform
Download brochure Thick800A
- EDX3600H alloy analyzer is developed by Skyray for alloy testing, reaches the international advanced level
- Testing sample include all alloy or metal components from Na to U
- Silicon drift detector (SDD), provided better energy linerity, resolution, spectrum characteristics and higher peak/base ratio
- Skyray's patent - Signal to noise enhancer (SNE), improves the signal processing ability by 25times or more.
- Built-in CMOS HD camera
Download brochure EDX3600H
Absotec Co., Ltd.
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